Hi Dick,
Tent and etch techology is not a big problem with 5/5.  The real problem
is the hole registration that usually goes along with 5/5 technolgies.
Yield losses are usually from drill accuracy more than anything.   I have
heard that some Asian companies enlarge the pads and reduce the
circuit width in the pad areas to give a little more latitude to registration.
Others plug the holes so tent failure is not an issue.

In regards to tent capability on the hole, we have proven that as long as
you have 1mil of resist left at a portion of the land area, the tent will
survive.  The new technology tent and etch resists are remarkably good
as compared to the older resists.

As far as horizontal plating, it is definitely a trend in Eruope and seems to
be catching on elsewhere.  It basically makes sense, but most problems
seem to be coming from copper nodules on the surface.  This is a
problem in high tech work since most of that work does not lend itself to
brush scrubbing due to elongation of substrates.  Therefore, without
brushing,  nodules pretty much stay as is which hinder dry film
conformation to the surface.

In addition, the horizontal plater seem to use higher brightner levels
which can cause adhesion problems with some dry films.  Sometimes
we have to brush scrub followed by a pumice scrub to get the required
adhesion of some films.

Hope things are going well for you.
Ken Bridges
Morton Electonic Materials

>>> Dick Desrosiers <[log in to unmask]> 07/22/98 08:13am >>>
Technetters

 Is it possible to produce 5/5 technology with a panel plate tent and etch
 process ?  Also, what are the strengths and weaknesses of horizontal
plating
processes ?  Can anyone provide me with info on horizontal electro
plating ?
 Thanks for your help

Dick Desrosiers

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