TECHNET Archives

July 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Plating
From:
Dick Desrosiers <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 22 Jul 1998 11:13:17 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 
Technetters

 Is it possible to produce 5/5 technology with a panel plate tent and etch
 process ?  Also, what are the strengths and weaknesses of horizontal plating
processes ?  Can anyone provide me with info on horizontal electro plating ?
 Thanks for your help

Dick Desrosiers

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2