Hello All.....

Is anyone aware of a study that quantifies the maximum number of heat
excursions that should be attempted on a typical FR-4 difunctional
material?  These excursions would include HASL, Wave, Reflow and Maximum
Rework Hits. Does this improve with the use of 140 Multifunctional
material?

Sincerely,

Nancy Nelson
Dell Computer
PCB Quality Development
Phone 512-335-9657


> -----Original Message-----
> From: [log in to unmask] at dell_unix
> Sent: Friday, July 17, 1998 12:55 PM
> To:   McMillan, Thad; Nelson, Nancy;
> Subject:      RE: [TN] Bull****:: ADMIN RESPONSE
>
> WAIT...
>
> Before everyone goes crazy, I am on the phone with MCI TechSupport as
> I write th
> is,
> to get this guy shut down.  Everything is under control....
>
> Hugo Scaramuzza
> Electronic Communications Administrator
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