Auger would work well for this type of system.  There are no overlap peaks
and light elements are seen with excellent results.  Depth profiling should
determine if the P is on the surface or a sub surface barrier layer.




At 01:17 AM 7/20/98 -0400, you wrote:
>     Below is a question about solderability of electroless nickel.
>
>
>______________________________ Forward Header
>__________________________________
>Subject: Analysis
>Author:  Edwin Louis at cmd-cs4-cc-p
>Date:    7/10/98 3:52 AM
>
>
>     Dan, here is the message I was trying to send to Peter.
>
>
>______________________________ Forward Header
>__________________________________
>Subject: Analysis
>Author:  Edwin Louis at cmd-cs4-cc-p
>Date:    7/10/98 3:03 AM
>
>
>     Peter we have some electroless nickel on aluminum in which  some
>times
>     you can solder to it with Sn63 and RMA flux and other times you
>     cannot. Some people have suggested that there are  various plating
>     types per various specs. that incorporate higher or lower amounts
>of
>     phosphorus. The high phosphorus containing plating presumedly do
>not
>     solder as well as the lower content plating. Another difference I
>     understand is that sometimes there are impurities of organics that
>     interfere with the soldering or perhaps heavy metal impurities that
>
>     interfere with solderability. We would like to analyze and compare
>the
>     two types of plating for these impurities. What do you suggest and
>for
>     how many dollars?
>        It appears after conversation with Dan Sostak that perhaps Auger
>     would be best because phosphorus probably migrates to the surface
>as
>     do organics. Because of the surface soldering process the culprits
>are
>     probably on the surface. As far as trace included organics are co
>     ncerned, will microscopic FTIR fit the bill? I would appreciate
>some
>     guidance from you on this matter.
>
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Tamara E. Bloomer
Assistant Scientist
Ames Laboratory
137 Wilhelm Hall
Ames, IA  50011
(515) 294-2564

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