TECHNET Archives

July 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Louis, Edwin" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 20 Jul 1998 01:17:00 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (59 lines)
     Below is a question about solderability of electroless nickel.


______________________________ Forward Header
__________________________________
Subject: Analysis
Author:  Edwin Louis at cmd-cs4-cc-p
Date:    7/10/98 3:52 AM


     Dan, here is the message I was trying to send to Peter.


______________________________ Forward Header
__________________________________
Subject: Analysis
Author:  Edwin Louis at cmd-cs4-cc-p
Date:    7/10/98 3:03 AM


     Peter we have some electroless nickel on aluminum in which  some
times
     you can solder to it with Sn63 and RMA flux and other times you
     cannot. Some people have suggested that there are  various plating
     types per various specs. that incorporate higher or lower amounts
of
     phosphorus. The high phosphorus containing plating presumedly do
not
     solder as well as the lower content plating. Another difference I
     understand is that sometimes there are impurities of organics that
     interfere with the soldering or perhaps heavy metal impurities that

     interfere with solderability. We would like to analyze and compare
the
     two types of plating for these impurities. What do you suggest and
for
     how many dollars?
        It appears after conversation with Dan Sostak that perhaps Auger
     would be best because phosphorus probably migrates to the surface
as
     do organics. Because of the surface soldering process the culprits
are
     probably on the surface. As far as trace included organics are co
     ncerned, will microscopic FTIR fit the bill? I would appreciate
some
     guidance from you on this matter.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2