We are looking for recommendations on the best methods/restrictions to
     mount a large, tall component to a board that will see approximately 50Gs
     of force in a shuttle application.

     The obvious choice of an alternate component package is being researched,
     but in the meantime, what are the guidelines for this type of assembly?

     My opinion:  Solder type is N/A as the functional PTHs are NOT to be used
     additionally as a mechanical means of retaining the part.

     Adhesive below the component, and on the sides of the component without
     leads in addition to hold down wire is all I can think of at this time.

     What about orientation?  What adhesives are best?  Should the adhesive be
     the same type for below and on the sides?  Was I correct in rejecting some
     addition of conformal coat as not being germane to the problem?

     Regards,

     Jan Pelchat
     Sr. QAE

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