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July 1998

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Subject:
From:
"Kasprzak, Bill (esd) US" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 18 Jul 1998 06:36:00 PDT
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Jared:

Just a couple of observations:

 - Having a solder pot in excess of 600 Deg. F will certainly create a dross
layer very rapidly thus making it almost impossible to adequately skim the
top prior to dipping the part. The recommended pot temperature per J-Std-002
is 473 Deg F.

 - Test method A also specifies that the item to be tested must be fluxed.

Did the outside lab use the J-std method or your 600 degree method ?

So, why not see if the parts can pass solderability testing the exact method
called out in the J-Std ? If they do not pass, then you may have legitimate
issues with your vendor.

Bill Kasprzak
Moog Inc.

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