Hi Technetters,

I have a question that I need an answer to.  I am having an ongoing
battle with one of our T/H power resistor vendors.

My question is:

In testing the lead solderability of a component, if the solder pot is a
>600 deg, would this be sufficient to burn off the oxides on the leads
and give an indication of acceptable lead solderability in the absense
of flux.

The QC tech set-up this procedure last year before he left and it was in
place before I arrived.  I have evaluated ANSI J/STD-002 test method A (
I have not had time to find out if there is an appropriate IPC standard)
and we can use this, but the vendor is screaming because we were not
using a "true" procedure.

In an attempt to validate this, last year, I sent a sample of resistors
from a lot that failed to an outside lab and they confirmed the
indication of failures.

Any input will be greatly appreciated, since I have to meet with the
vendor next wedensday to resolve this.

Thanks in advance,

Jared Lang
Manufacturing Engineer
Minarik Corp.
Glendale, CA.
818-637-7434

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