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July 1998

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Subject:
From:
"McMonagle, Michael R." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 17 Jul 1998 13:56:38 -0500
Content-Type:
text/plain
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text/plain (56 lines)
Kathy,
        There is a system (Bump-It) out there from a company called
Galahad (561-487-0271) that places spheres on components to reball them.
I'm sure that it could be used to place them on a fab instead. Out of
curiosity, why are you putting them on a fab?

MikeMcM

> -----Original Message-----
> From: Kathy Palumbo [SMTP:[log in to unmask]]
> Sent: Friday, July 17, 1998 1:23 PM
> To:   [log in to unmask]
> Subject:      [TN] BGA Ball Attachment Process
>
> I need to attach BGA balls to a PCB.  Does anyone out there know how
> this
> Balling process should be done?
>
> Is there anyone out there capable of performing this Balling Process
> for me,
> or can you recommend equipment that could do it for me?
>
> Your help in this matter is greatly appreciated!!
>
> Thanks in advance!!
>
> Sincerely,
> Kathy Palumbo
>
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