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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 17 Jul 1998 10:26:46 -0600 |
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Seems to be a fine (less than 1 mm pitch) BGA. People are assembling such
parts with many many more bumps (tens to hundreds of bumps). One necessary
advice I have seen worthy of note is that do not tweak placement manually
before reflow.
Syed.
-----Original Message-----
From: [log in to unmask] [SMTP:[log in to unmask]]
Sent: Wednesday, July 15, 1998 12:32 PM
To: [log in to unmask]
Subject: [TN] Assembly unusual part?
All,
I have received a request from a customer to install an unusual
package on
their board. The package dimension is .85mm x .85mm (yes,
millimeters) with
four solder bumps. The solder bumps is .16mm - .18mm in diameter
with a .5mm
pitch.
The part is .78mm thick. The material is silicon.
Question 1: What do you call this type of package?
Question 2: Is there a recommended assembly process?
Here is my plan of action:
1. Get data on the type of solder bump
2. Use sticky flux and not paste to print
3. Use Machine or hand mount the component
4. Use X-ray to inspect for misaligment
5. Reflow and X-ray
Thank you for your input!
Tuan
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