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July 1998

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 Jul 1998 22:46:17 -0400
Content-Type:
text/plain
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text/plain (148 lines)
I am going to see what I can round up and bring to Providence.  I hope
everybody else will also respond to the appeal Dave Hillman has made on
behalf of Les and his committee.

regards,
Bev Christian
Nortel

> ----------
> From:         David D Hillman[SMTP:[log in to unmask]]
> Sent:         Tuesday, July 14, 1998 9:33 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Provide me your current BGA Spec on void
>
> Hi Bev! Wow, there has been quite a bit of interest in the amount of
> voiding allowable on BGA components on TechNet! The current ANSIJ-STD-001C
> draft proposal has a new paragraph in section 9.2.6.9 titled Ball Grid
> Arrays with the proposed voiding limits in Table 9-10 of 25% for Class1/2
> products and 10% for Class 3 type products. If people don't like those
> numbers my suggestion is to get involved with the 001 specification
> committee - bring test data to support your   % void limits suggestions.
> These current numbers originated from 2 data sets submitted and reviewed
> by
> a 001 subcommittee lead by Les Hymes. I know the committee would love to
> have additional test data sets submitted to further support the % voiding
> limit value discussions (for the current proposed values or any other
> suggested values) .
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
>
> Bev Christian <[log in to unmask]> on 07/10/98 09:16:26 PM
>
> Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
> respond
>       to Bev Christian <[log in to unmask]>
>
> To:   [log in to unmask]
> cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
> Subject:  Re: [TN] Provide me your current BGA Spec on void
>
>
>
>
> Ken,
> You mean to say you have customers knowledgeable enough that they know
> they
> should be asking for more than just the presence of a shiny fillet?!!!  We
> obviously give them more than that or we wouldn't still be in business,
> but
> I am truly surprised to hear you ask your question in terms of customer
> knowledge.  Of course what is worse is a customer that thinks he knows
> what
> he/she is talking about, but doesn't.  A case in point is the new Bellcore
> GR-78 that specifies an impossibly low void criteria for all joints.
>
> In response to the last question of this type Dave Hillman said more was
> done at the last IPC meeting on this subject, but I don't recall what was
> said specifically about size and % voiding?  Dave, others?
>
> regards,
> Bev Christian
> Nortel
>
> > ----------
> > From:         Ken Patel[SMTP:[log in to unmask]]
> > Sent:         Friday, July 10, 1998 6:21 PM
> > To:   [log in to unmask]
> > Subject:      [TN] Provide me your current BGA Spec on void
> >
> > Technetters,
> > What is your current spec on accepting void in BGA joints? Are you going
> > by
> > spec of 10 mil, meaning void more than 10 mils is reject? What are your
> > customers specifying in assembly drawings?
> >
> >
> > re,
> > ken patel
> > ______________________________________________________
> > Ken Patel                       Phone:  (408) 490-6804
> > 1708 McCarthy Blvd.             Fax:    (408) 490-6859
> > Milpitas, CA 95035              Beeper: (888) 769-1808
> >
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