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July 1998

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Subject:
From:
Howard Lin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 16 Jul 1998 09:45:39 +0800
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I heard that somebody try to reduce the thickness of electrical soft
gold plating( <20 u"). And somebody try to use immersion gold for gold
wire bonding. What's your opinion on this information.

Howard Lin
Maxedge RD Center

> -----Original Message-----
> From: (George  Milad) [SMTP:[log in to unmask]]
> Sent: Thursday, July 16, 1998 8:54 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Immersion gold for wire bonding, a reply
>
> Gold wire bonding: requires adequate thickness of a compatible metal,
> these
> may be gold or palladium. Examples are:
> Electrolytic Ni with Electrolytic soft gold (>20 uins)
> Electroless Ni with Electroless gold (>20 uins)
> Electroless NI with electroless Pd (10-15 uins) with immersion gold
> flash (1
> uins)
> Traditionally immersion gold at < 5 uins  has limited success for gold
> wire
> bonding.
> Electroless Ni (150 uins) with Immersion gold (>5uins) is  an ideal
> finish for
> Al wire bonding.  The Al wire bonds readily to the underlying Ni.
>
> George Milad
> Technical Mkt Mngr
> LeaRonal Inc
>
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