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July 1998

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Subject:
From:
"(George Milad)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 Jul 1998 20:54:27 EDT
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Gold wire bonding: requires adequate thickness of a compatible metal, these
may be gold or palladium. Examples are:
Electrolytic Ni with Electrolytic soft gold (>20 uins)
Electroless Ni with Electroless gold (>20 uins)
Electroless NI with electroless Pd (10-15 uins) with immersion gold flash (1
uins)
Traditionally immersion gold at < 5 uins  has limited success for gold wire
bonding.
Electroless Ni (150 uins) with Immersion gold (>5uins) is  an ideal finish for
Al wire bonding.  The Al wire bonds readily to the underlying Ni.

George Milad
Technical Mkt Mngr
LeaRonal Inc

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