TECHNET Archives

July 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Assembly unusual part?
From:
[log in to unmask]
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 Jul 1998 14:32:20 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (36 lines) 
All,

I have received a request from a customer to install an unusual package on
their board.  The package dimension is .85mm x .85mm (yes,  millimeters) with
four solder bumps.  The solder bumps is .16mm - .18mm in diameter with a .5mm
pitch.
The part is .78mm thick.  The material is silicon.

Question 1:  What do you call this type of package?

Question 2:  Is there a recommended assembly process?

Here is my plan of action:

1. Get data on the type of solder bump
2. Use sticky flux and not paste to print
3. Use Machine or hand mount the component
4. Use X-ray to inspect for misaligment
5. Reflow and X-ray

Thank you for your input!

Tuan

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2