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July 1998

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Subject:
From:
"Leslie O. Connally" <[log in to unmask]>
Reply To:
Leslie O. Connally
Date:
Wed, 15 Jul 1998 10:04:40 -0700
Content-Type:
text/plain
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text/plain (64 lines)
Hi Alex & other Technetters,

We manufacture MCB's at our facility and do a Direct plate ATOtech process
following a tetraetch. The process seems to work just fine.

Regards,
Les Connally

>  From: Alex Stennett <[log in to unmask]>, on 7/14/98 12:19 PM:
>  Has anyone considered the possibility of electroplating materials by
>  applying a layer of conducting matereial first ...... I know it is a
>  strange idea but I thought it might work and wondered if anyone was
>  interested ................. ie I want to be in on the patent if it
>  works!!!!!!!
>
>  The process might cut out several stages in through hole plating too
>  but it does mean changing the chemistry a little ............
>
>  [log in to unmask]
>  Alex Stennett
>  Research Associate
>  Loughborough University
>  Dept. of Manufacturing Engineering
>  Leics
>  LE11 3TU
>  Tel:- +44 (0)1509 228251
>  Fax:- +44 (0)1509 267725
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