Subject: | |
From: | |
Reply To: | Leslie O. Connally |
Date: | Wed, 15 Jul 1998 10:04:40 -0700 |
Content-Type: | text/plain |
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Hi Alex & other Technetters,
We manufacture MCB's at our facility and do a Direct plate ATOtech process
following a tetraetch. The process seems to work just fine.
Regards,
Les Connally
> From: Alex Stennett <[log in to unmask]>, on 7/14/98 12:19 PM:
> Has anyone considered the possibility of electroplating materials by
> applying a layer of conducting matereial first ...... I know it is a
> strange idea but I thought it might work and wondered if anyone was
> interested ................. ie I want to be in on the patent if it
> works!!!!!!!
>
> The process might cut out several stages in through hole plating too
> but it does mean changing the chemistry a little ............
>
> [log in to unmask]
> Alex Stennett
> Research Associate
> Loughborough University
> Dept. of Manufacturing Engineering
> Leics
> LE11 3TU
> Tel:- +44 (0)1509 228251
> Fax:- +44 (0)1509 267725
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