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July 1998

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Subject:
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 Jul 1998 09:21:02 -0500
Content-Type:
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Hi Howard - check out the following paper: "Thermosonic Gold Ball Bonding
to Immersion Gold/ Electroless Nickel Plating Finishes on Laminate MCM
Substrates" , R. Wayne Johnson et al, International Journal of
Microelectronics and Electronic Packaging, Vol. 20, Number 3, third quarter
1997, page 317-324. It maybe helpful. I have had some limited success with
gold wedge bonding on IM/NI. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]





Howard Lin <[log in to unmask]> on 07/15/98 08:46:58 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  Re: [TN] Immersion gold for wire bonding




Hi teachers,

Has anybody heard about  the appllication of immersion gold on wire
bonding? Do you think it is possible or not? What is the necessary
quality issue of immersion gold for wire bonding? I'd like to know what
is the basic quality requirement of immersion gold for wire bonding.
Thanks for your help in advance.
Best Regards

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