Hi Pat - the ANSIJ-STD-003 committee has completed a gauge R&R study on the
current SERA equipments. The committee completed two rounds of testing
involving 3 specific SERA equipment designs. The gauge R&R was found to be
below the 10% limit the committee members selected as a passing
requirement. A paper detailing the study was published as part of the IPC
EXPO 1997 titled "Evaluating A New Process Control Tool: How Good Is Good
Enough? An IPC/EIA Round Robin Investigation". The ANSIJ-SD-003 committee
voted to put the SERA methodology into the IPC 650 test methods
specification and not in the JSTD-003 specification until more industry
solderability data was submitted to the 003 committee for review. There are
a number of folks using the SERA methodology for solderability and surface
finish analysis. I have been very successful in tin/lead surface analysis -
contact me off-line and I can give you additional details.


Dave Hillman
Rockwell Collins
[log in to unmask]
319-295-1615




"Hogue, Pat (AZ76)" <[log in to unmask]> on 07/14/98 08:23:45 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to "Hogue, Pat (AZ76)" <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  [TN] SERA Testers




I learned today that we have a sequential electrochemical reduction
analyzer (SERA) made by ECI.  Are there any other makers of this kind
of instrumentation?

Back in the distant path of my undergraduate chemistry training I
remember cyclic voltammetry with beautifully resolved reduction
curves, not at all like the low resolution DC reduction curves I've
seen so far.

Is SERA testing becoming (or has it become) the accepted method for
qualitative analysis for solderability?

[log in to unmask]

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