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July 1998

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Subject:
From:
"Frank K. Frimpong" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 14 Jul 1998 15:59:15 +0000
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Hang on while I put on my flame proof suit...

Fr5 certainly processes better mechanical (modulus etc.) and thermal
properties.
However I would not switch to Fr5 just yet. Take a closer look at your
lamination process, lay-up process, build up configuration etc.

How thick is your core material?
How thick is the total construction?
What is the balance of copper  in the construction?
At what stage of the process is the warpage evident?
What is your press profile?

F.K.Frimpong

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