Hi Bev! Wow, there has been quite a bit of interest in the amount of
voiding allowable on BGA components on TechNet! The current ANSIJ-STD-001C
draft proposal has a new paragraph in section 9.2.6.9 titled Ball Grid
Arrays with the proposed voiding limits in Table 9-10 of 25% for Class1/2
products and 10% for Class 3 type products. If people don't like those
numbers my suggestion is to get involved with the 001 specification
committee - bring test data to support your   % void limits suggestions.
These current numbers originated from 2 data sets submitted and reviewed by
a 001 subcommittee lead by Les Hymes. I know the committee would love to
have additional test data sets submitted to further support the % voiding
limit value discussions (for the current proposed values or any other
suggested values) .

Dave Hillman
Rockwell Collins
[log in to unmask]





Bev Christian <[log in to unmask]> on 07/10/98 09:16:26 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to Bev Christian <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  Re: [TN] Provide me your current BGA Spec on void




Ken,
You mean to say you have customers knowledgeable enough that they know they
should be asking for more than just the presence of a shiny fillet?!!!  We
obviously give them more than that or we wouldn't still be in business, but
I am truly surprised to hear you ask your question in terms of customer
knowledge.  Of course what is worse is a customer that thinks he knows what
he/she is talking about, but doesn't.  A case in point is the new Bellcore
GR-78 that specifies an impossibly low void criteria for all joints.

In response to the last question of this type Dave Hillman said more was
done at the last IPC meeting on this subject, but I don't recall what was
said specifically about size and % voiding?  Dave, others?

regards,
Bev Christian
Nortel

> ----------
> From:         Ken Patel[SMTP:[log in to unmask]]
> Sent:         Friday, July 10, 1998 6:21 PM
> To:   [log in to unmask]
> Subject:      [TN] Provide me your current BGA Spec on void
>
> Technetters,
> What is your current spec on accepting void in BGA joints? Are you going
> by
> spec of 10 mil, meaning void more than 10 mils is reject? What are your
> customers specifying in assembly drawings?
>
>
> re,
> ken patel
> ______________________________________________________
> Ken Patel                       Phone:  (408) 490-6804
> 1708 McCarthy Blvd.             Fax:    (408) 490-6859
> Milpitas, CA 95035              Beeper: (888) 769-1808
>
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