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July 1998

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Subject:
From:
Alex Stennett <[log in to unmask]>
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Date:
Tue, 14 Jul 1998 12:19:14 +0000
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Has anyone considered the possibility of electroplating materials by
applying a layer of conducting matereial first ...... I know it is a
strange idea but I thought it might work and wondered if anyone was
interested ................. ie I want to be in on the patent if it
works!!!!!!!

The process might cut out several stages in through hole plating too
but it does mean changing the chemistry a little ............

[log in to unmask]
Alex Stennett
Research Associate
Loughborough University
Dept. of Manufacturing Engineering
Leics
LE11 3TU
Tel:- +44 (0)1509 228251
Fax:- +44 (0)1509 267725
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