Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 13 Jul 1998 10:18:41 -0700 |
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Mr. Bisson
Please get hold of a March issue of Circuit Assembly. There is
an article that might help you with solderball problem. I am
available to discuss with you if you have further questions.
regards
matthew
SMT Manufacturing Engineer
NII Norsat International Inc.
604-597-6200, ext 254
>>> Andre Bisson <[log in to unmask]> July 10,
1998 10:40 am >>>
Hello,
I need help from people who assembled board using NC solder
paste. I'm
presently facing some issues with solder balling after reflow
using NC paste.
Our parameter are:
NC paste
Good standard profile
Homeplate opening for chip (mpm printer)
Panasonic equipment for pick and place
I'm use to run board with the following parameter with any solder
ball
(different company):
Water paste
Good standard profile
Opening reduce by 0.002" than the pad size (mpm printer)
Contact system or Fuji Cp pick and place
I will like to have comment from people who use NC paste and
don't have
this problem. If possible can you tell me why I have solder ball. I
take a
close look of the board and they are built with the ipc standard.
Thank you very much,
________________________________
Andre Bisson
Process Engineering
Matrox Electronic Systems
Tel.: (514) 969-6000 Ext: 2462
E-mail: [log in to unmask]
________________________________
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