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July 1998

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From:
Andy Magee <[log in to unmask]>
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Date:
Sun, 12 Jul 1998 08:14:08 -0400
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Howard,

My understanding of Pacovia is that it's designed to flow under pressure
even at low temperature. This is supposed to allow it to perform a
damming function around openings before the resin flows. However that
characteristic implies that it may not do well with too much heat and
pressure. I'd have to go find the data sheets to know if you're
exceeding its' capabilities, but what are your lamination parameters?
Time, Temp., Pressure, and Heating Rate. (The heating rate has a
significant effect on minimum viscosity and flow.) What's the whole
stack-up layering?

While I've found the PACO products to be pricey, they are typically of
the highest quality and work as designed with a reasonable amount of
room for process development.

Andy Magee
Flex Guru
[log in to unmask]

Howard wrote,

I got some troubles on sequential lamination for blind vias. Because the

resin will flow onto the copper surface during lamination process, it
will get troubles on pattern forming process. I use PACO VIA #4000 for
release film on lamination process. But I found there are two issues
that I should care. One is the cost of PACO VIA very high, the other is
that there is some residual on seperate plate after lamination process.
Is there any recommend for  sequential lamination process? I wish I can
get solution from you as soon as possible.

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