Dear All,

I got some troubles on sequential lamination for blind vias. Because the
resin will flow onto the copper surface during lamination process, it
will get troubles on pattern forming process. I use PACO VIA #4000 for
release film on lamination process. But I found there are two issues
that I should care. One is the cost of PACO VIA very high, the other is
that there is some residual on seperate plate after lamination process.
Is there any recommend for  sequential lamination process? I wish I can
get solution from you as soon as possible.

Best Regards,

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