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July 1998

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 10 Jul 1998 22:16:26 -0400
Content-Type:
text/plain
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text/plain (64 lines)
Ken,
You mean to say you have customers knowledgeable enough that they know they
should be asking for more than just the presence of a shiny fillet?!!!  We
obviously give them more than that or we wouldn't still be in business, but
I am truly surprised to hear you ask your question in terms of customer
knowledge.  Of course what is worse is a customer that thinks he knows what
he/she is talking about, but doesn't.  A case in point is the new Bellcore
GR-78 that specifies an impossibly low void criteria for all joints.

In response to the last question of this type Dave Hillman said more was
done at the last IPC meeting on this subject, but I don't recall what was
said specifically about size and % voiding?  Dave, others?

regards,
Bev Christian
Nortel

> ----------
> From:         Ken Patel[SMTP:[log in to unmask]]
> Sent:         Friday, July 10, 1998 6:21 PM
> To:   [log in to unmask]
> Subject:      [TN] Provide me your current BGA Spec on void
>
> Technetters,
> What is your current spec on accepting void in BGA joints? Are you going
> by
> spec of 10 mil, meaning void more than 10 mils is reject? What are your
> customers specifying in assembly drawings?
>
>
> re,
> ken patel
> ______________________________________________________
> Ken Patel                       Phone:  (408) 490-6804
> 1708 McCarthy Blvd.             Fax:    (408) 490-6859
> Milpitas, CA 95035              Beeper: (888) 769-1808
>
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