Matt, non wetting of a pad or land after HASL is very possible.  My
guess is the large areas had exposed CU on reciept.  In the areas around
the annular ring, may be a little Solder mask "bleed-out" or other
Solder mask related issue.  The chances of somethin chompin it off
during component attachment is slim.

Hope this helps,

Mark Simmons

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