Hello,

I need help from people who assembled board using NC solder paste. I'm
presently facing some issues with solder balling after reflow using NC paste.

Our parameter are:

NC paste
Good standard profile
Homeplate opening for chip (mpm printer)
Panasonic equipment for pick and place

I'm use to run board with the following parameter with any solder ball
(different company):

Water paste
Good standard profile
Opening reduce by 0.002" than the pad size (mpm printer)
Contact system or Fuji Cp pick and place

I will like to have comment from people who use NC paste and don't have
this problem. If possible can you tell me why I have solder ball. I take a
close look of the board and they are built with the ipc standard.

Thank you very much,



________________________________

Andre Bisson
Process Engineering
Matrox Electronic Systems
Tel.: (514) 969-6000 Ext: 2462
E-mail: [log in to unmask]
________________________________

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