Can anyone point to a standard regarding dewetting of PWBs at assembly?
We would like to know if there is a spec for the high reliablity class
that defines acceptable levels of dewetting.  We have SMT boards that
soldered beautifully for a long time, and all of a sudden, any date codes
past a certain time started to show gross dewetting all over, even though
the HASL surface appears as good or better than before.

If anyone can give the standard number and paragraph, and/or list the
basic requirements, we would appreciate it.

Thanks!

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