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July 1998

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Subject:
From:
Ken Patel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 9 Jul 1998 10:03:56 -0700
Content-Type:
text/plain
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text/plain (38 lines)
Hi Technetters,
I had some discoloration problem on random pad locations on Ni/Au plated
boards. Following is the response from my vendor, please prove me your comments.

"                  the average Ni thickness = 162 microinch

                   the average Au thickness = 5.8 microinch


They ran a solderability test which passed, verifying no contamination.  The
belief is that the Ni sometimes dispositions rougher, leaving a semi-mat
color versus the normal shinny disposition, lending to a variance in the
Gold coloring in some areas.  Due to the immersion gold being a pure gold,
with a self eliminating thickness, this variance in color can and is more
prevalent than the thicker electrolytic Gold process.  "

Note: Can you suggest any lab in San Jose/Milpitas Area where I can take
fabs to verify this?

re,
ken patel
______________________________________________________
Ken Patel                       Phone:  (408) 490-6804
1708 McCarthy Blvd.             Fax:    (408) 490-6859
Milpitas, CA 95035              Beeper: (888) 769-1808

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