Ed:

The CMI unit we are using is self calibrating for hole size and copper thickness.  The measuring head is able to sense the board thickness and the hole diameter.  If any case they claim correspondence of 10%
between their measurement and a microsection.

UPA's caviderm requires manual entry of the hole diameter and board thickness.  The best hole diameter to use is the finished hole diameter after copper plating (no solder).  A close second is the finished hole
diameter including solder.  I don't recall if the readings for board thickness are best over circuitry or over laminate.

Both instruments require corrections for inner layer copper on multilayers.  Please contact me offline if you need more detailed info.

Don Vischulis
ITO Industries
[log in to unmask]

Ed Cosper wrote:

> Hi all,
>
> I have a simple question.  When setting up or programming measuring equipment such as the CMI and Caviderm units, is the referenced hole size you enter into the set up the drilled hole size or plated hole size?

snip ----------------------------

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################