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July 1998

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Subject:
From:
Kathy Palumbo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 8 Jul 1998 15:14:34 -0700
Content-Type:
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Bruce,

We had our system retro-fitted in the field.  Here is the list of issues we
are currently having with the system.

Process Problem Items:
        1.      After installing new 350mm Wiper foil with metal strip glued
on it, It worked for about a week and suddenly metal strip started peeling
off from wiper foil.
        2.      End retainers (SKIS) has hard plastic piece glued on rubber
piece. That plastic piece comes off from End retainer. So far, we have
changed 4 End retainers.
        3.      In transfer head you have removable grid between paste
cassette and conditioning chamber. This removable grid has `O' Ring . This O
ring is larger than it's slot on removable grid.  After placing O ring on
the grid, when you   invert the grid to fit on conditioning chamber O ring
comes off. We had to glue
        the O ring in slot.
        4.      Removable grid on transfer head doesn't stay flat on
conditioning chamber. After you tighten the screws, it becomes convex.
        5.      Holes on removable grid and holes on metal grid do not
match.
        6.      Solder paste come out from ski area on stencil.
        7.      After print, it leaves streak of solder on stencil.
        8.      Lots of solder paste oozes out from gap between paste
cassette and conditioning chamber. Making transfer head very messy.
        9.      After printing about 10 panels , next panel has insufficient
solder. We prime 3 times solder paste at this time. But half of the time it
still has insufficient
        solder on panel, at time we increase pneumatic pressure and it comes
out O.K.
        10. We do not have sensor for `Paste cassette empty.'  The one we
had was bad and service man took it with him saying they will mail us new
one . it's about 3 weeks now, and we haven't heard anything about it from
any one at DEK.
        11. Paste cassette has 1.2kg solder paste in it and we can use only
half of it, other half goes to waste.
        12. We spent about $ 30,000.00 for Proflow compare to $300.00 for
squeegee blades expecting much better print results, no solder paste waste,
cutting down on stencil cleaning time and worry free printing . But that's
not the case.

As you can see it is quite a list.  I believe that this system would be a
good system, but there are a lot of bugs they need to work out.  I think
they were in too big of a hurry to release to market, and didn't work all
the bugs out first.

A Dek guy will be here Monday.

Hope this helps.

Thanks,
Kathy Palumbo

> ----------
> From:         Bruce Robertson[SMTP:[log in to unmask]]
> Sent:         Wednesday, July 08, 1998 2:22 PM
> To:   [log in to unmask]
> Subject:      [TN] Attn. Users of DEK ProFlow system
>
> Hello,
>
> We are currently considering the purchase of a DEK ProFlow paste head
> for retrofitting to a DEK 265 lt. I don't know of any other company that
> is
> using this system (certainly in New Zealand anyhow), but from the sales
> pitch it seems to offer some significant advantages, particularly with
> reduced paste wasteage.
> What I want to know however, is does anybody out there have
> experience with it in a production envoronment. Is there a downside to
> using this system? Has it proved reliable? Does it deliver high quality
> printing? Are the paste savings realised in practise?
>
> Thanks in advance for any advice you can offer.
>
> Regards
>
> Bruce Robertson
> Production Engineer
> Tait Electronics Ltd
> Christchurch
> New Zealand
>
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