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July 1998

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Subject:
From:
Achim Neu <[log in to unmask]>
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Date:
Wed, 8 Jul 1998 22:53:45 +0200
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Hello Simon,

we have checked this topic two years ago and your supplier speaks the truth.
We have compared chemical NiP and also electrolytic NiP were you are able to increase P % up to 15%.

The bondability is best between 8 - 15% and the solderability is best in range of 7-9% P out of the fact
that the %P is not stable above 11% P under temperature and the solderability decrease your supplier is
right.

Regards
Achim

Hütter Simon schrieb:

> Hello Techneters.
>
> I have heard that the phosphorous content of electroless Ni
> should be more than 10% to avoid microcracks in the Ni
> under the Au. Also it should be better for wire bonding.
>
> But on the other hand it must be less then 10% for a good solderability
> (discussed here before).
>
> Our electroless Ni/Au has a P content of 8-10%. And the supplier says
> that this is perfect for soldering and wire-bonding.
>
> Can anyone help me out of this?
>
> Thanks
> Simon
>
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