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July 1998

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Subject:
EP&P article, Au diffusion in near eutectic solder.
From:
"Alderete, Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 8 Jul 1998 07:32:29 -0700
Content-Type:
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This may be of interest:

Article, "Effects of gold diffusion on a near-eutectic solder joint," by
Seth Enwright of Lockheed Martin, Hudson, NH.

...in Electronic Packaging & Production magazine, June 1998 issue, p.
68-72

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