Hi Thomas - Contact Danny Miller (319-655-3673) at the EMPF in Indianapolis
IN about the possibility of using Reduced Oxide Soldering Activation (ROSA)
technology for removing the oxide. A small consortia team comprised of
Nortel, Allen Bradley, Rockwell, CSL Inc. SEHO USA, and EMPF just completed
a DARPA contract demonstrating the restoration of printed wiring boards,
flip chip assemblies, and components. The ROSA technology uses
electrochemical reduction to restore solderability of a variety of surface
finishes.  An in-line and a benchtop ROSA system has been established at
the EMPF so that any interested electronics industry companies can
investigate the restoration technology with their boards and/or components
issues. You can also contact me off-line if you have additional questions.
Good Luck.


Dave Hillman
Rockwell Collins
[log in to unmask]





Thomas Jacob <[log in to unmask]> on 07/08/98 05:08:34 AM

Please respond to [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  [TN] Oxidized HASL boards




Hi Technetters

We have a full rack of rigid polyimide boards with pale, oxidized
surface onto the HASL-solder pads.
How can we remove the oxide layer whithout scrapping the boards?
Is there an economical way to run thru a cleaning machine?
I don't want to heat up the boards to reflow the solder...

Your help will be highly appreciated

Thomas Jacob

Phone:  0041-1-306 24 07 (direct)
Fax:    0041-1-306 36 40
e-mail: [log in to unmask]
Internet: http://www.dyconex.com

DYCONEX LTD.
Unterwerkstrasse 3
CH-8052 Zurich
Switzerland

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