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July 1998

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Subject:
Re: White Tin Immersion
From:
"Joy, Stephen C" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 10 Jul 1998 13:08:00 -0700
Content-Type:
text/plain
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text/plain (50 lines) 
Chris,
Does 'organometallic tin' mean a co-deposited polymer?
Steve

I am aware of the Dexter Dexcoat FST process. This is an organometallic tin
that places a barrier layer on the copper surface that greatly retards the
copper tin migration to a point that shelf life well in excess of one year
is
easily achievable. This process produces a lead free planar surface that has

better solderability than Ni/AU. Some OEM's have claimed that this process
is
the only alternative finish that they can run on the same assembly line with

HASL product and no changes need to be made. The key here is that the
process
in not an ordinary immersion tin which would have a very limited shelf life.

Regards,
Chris McGary

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