I concur with David ; have been watching this discussion for some time
and kept out as I thought perhaps I'm the odd one out in extreme as
usual ; but since Dave cracked the pot the way it is :
If the process is out of window to such a degree this kind of machinery
is needed ;
I'd say $ much better spend would be in the process gear ; not
inspection gear .
The ICT ( I know , not exactly a process gear ; but touch more useful
than XR ) is certainly much more inquisitive about the actual status
(working) not just visual with gross limitations and price tag .
Therefore design for test ; stable process and ICT will get you through
with much greater degree ( checking the chip at the same time [you don't
need to if it's Rockwell]) of assurance and miles cheaper as well ;
than if you really want to know (we're in relative extreme now) have the
bed of nails pad clamped to board in enviro chamber and watch few cycles
on event detector , not one dry joint escapes ; than you have your SPC
base ; on the way to functional future .
Presuming the life tests of your particular process (cycling) has been
done ; therefore process verified .
Dave's method of establishing the process with XR and monitor on ICT is
fine if you can justify the expense ;
however if you use ICT locate the fault and than perform a series of
cross sections as you tune the process you won't go broke and on top you
have nice validation on hand .

Thanks Dave ;

Paul Klasek
http://www.resmed.com

> ----------
> From:         David D Hillman[SMTP:[log in to unmask]]
> Sent:         Thursday, 30 July 1998 23:16
> To:   [log in to unmask]
> Subject:      Re: [TN] Glenbrook x-ray??
>
> Hi Rick - the introduction of the ball grid array type package has
> created
> an opportunity that I think many assemblers are missing: an
> opportunity to
> use test rather than visual inspection to judge the quality of a
> processed
> assembly. I am currently evaluating the Glenbrook MINIRTX system and
> am
> quite happy with it. However, the system is not powerful enough to
> "see"
> opens or poor wetting. I have been using the system as a tool to
> establish
> process control - we look for shorts, misalignments, stray solder
> balls,
> etc. on a sampling basis and then use electrical test to verify
> functionality. We also have done some minor metallographic
> cross-sectioning
> to confirm reflow profiles, cleaning, etc.  You can find some very
> capable
> xray equipment that will find all the defects of interest (within
> reason,
> no bonfires please) but these equipments come with a pricetag. One
> alternative is to use a combination of lower capability xray systems
> and
> electrical test. Good Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
>
> Rick Thompson <[log in to unmask]> on 07/29/98 01:27:43
> PM
>
> Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
> respond
>       to Rick Thompson <[log in to unmask]>
>
> To:   [log in to unmask]
> cc:
> Subject:  [TN] Glenbrook x-ray??
>
>
>
>
> Hi,
>
> We're starting to look into x-ray systems, specifically for BGA
> inspection.
> Units by Glenbrook caught my attention due to their low cost relative
> to
> other units on the market.  Anybody have any feedback, positive or
> negative
> on their products?
>
> I'd also appreciate any other insight you might care to share
> regarding
> other vendors and BGA X-ray.
>
> Thanks.
>
> Rick Thompson
> Ventura Electronics Assembly
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
> 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following
> text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
> section
> for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
> ################################################################
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
> 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
> section for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
> ################################################################
>

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################