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From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 30 Jul 1998 13:24:56 -0700 |
Content-Type: | text/plain |
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I just received a new assignment from my manager to come up with a list
of spec. for inspecting BAG components using X ray machine after the
part is placed on the PCB. I want to know that if there is an
industry standard already exists in the market, are there any on line
articles that talk about the subject and if anyone will willing to
share his/her knowledge with me. My second question is that is it
possible to inspect BGA on a double sided assembly....if the answer is
yes, then what are the areas I need to watch out for?
Thank you for your time to view my message.
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