Hello all,

We are now placing 56 bump uBGA's on several boards.  Occationally some of
the parts are blown off in the reflow oven, usually in the first 2 zones.  I
have also noticed that the parts after placement move quite easily, (appears
that so little paste is deposited that what's left is not very sticky).
Presently I'm using a standard .012 aperture in a .004 stepdown.  I am
considering trying a .014 square aperture with .006 radii on the corners on
a .006 stainless stencil  laser cut of course.  Has anyone run into this
problem or know of any solutions?  Any help is welcomed.

Russ Vertefeuille

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################