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July 1998

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TechNet <[log in to unmask]>
X-To:
"Lamond, Doug" <[log in to unmask]>
Date:
Tue, 7 Jul 1998 11:29:52 -0400
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[log in to unmask]
Subject:
Re: Copper Stains on suface of Au Fingers
From:
Ryan Jennens <[log in to unmask]>
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Phoenix Engineering Design, Inc.
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Doug-

    Is it possible that the copper is diffusing into the gold and that a
nickel (or similar) barrier is required between the copper and gold?
Just a thought...

Ryan

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