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Fri, 31 Jul 1998 10:52:17 -0700 |
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Earl & Joseph,
I'm not sure what the answer is, but most of the electrolytic Nickel I know of
also contain Phosphorus. Perhaps the answer is in a thicker or electrolytic
Gold.
I'll be interested in the resolution to this one.
Regards,
Les Connally
> From: Earl Moon <[log in to unmask]>, on 7/31/98 8:19 AM:
> Joseph,
>
> I just asked a question concerning phosphorous intermetallic growth as
> in item 16 or so. I was prompted to do so because of a response I
> received some weeks ago concerning the issue you raise.
>
> Again, a major BGA supplier (Motorola) wrote me and confided they found
> the problem associated with their sphere attachment to a substrate using
> the immersion tin and gold processes. To make a long story short,
> someone, at some time dropped a board on the floor detaching BGA devices
> at all their termination points.
>
> My question to industry is what can we do to overcome the phosphorous
> intermetallic and resulting solder joint embrittlement problem? Can we
> go to electroplated nickel in required thicknesses and then deposit
> electroless gold over that?
>
> Earl Moon
>
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