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Mon, 20 Jul 1998 08:33:44 -0400 |
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We are looking for recommendations on the best methods/restrictions to
mount a large, tall component to a board that will see approximately 50Gs
of force in a shuttle application.
The obvious choice of an alternate component package is being researched,
but in the meantime, what are the guidelines for this type of assembly?
My opinion: Solder type is N/A as the functional PTHs are NOT to be used
additionally as a mechanical means of retaining the part.
Adhesive below the component, and on the sides of the component without
leads in addition to hold down wire is all I can think of at this time.
What about orientation? What adhesives are best? Should the adhesive be
the same type for below and on the sides? Was I correct in rejecting some
addition of conformal coat as not being germane to the problem?
Regards,
Jan Pelchat
Sr. QAE
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