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If you are trying to "heat sink" the parts, you can increase your copper weight to 3 oz or greater. You
can also reduce your dielectric between the component layer and layer 2. I would recommend that you place
your ground layer on layer 2 to minimize your noise if you do this. You can also increase your layer count
and place a second ground layer in the board. If you do this, use caution as to keep your design
symmetrical to prevent warpage.
If this doesn't work, I would suggest an external heatsink. Good Luck JOHN WAITE
Vaughan, Ralph H wrote:
> Dear PWB fab guys,
>
> Can you provide any news, good or bad, on material used in boards to
> help move heat away from hot parts? We have tried the standard methods
> of leaving unused copper in the board rather than etching it away, and
> using thermal pads under the parts, but my designers think they need
> more thermal conduction through the pwb. If anyone has any experience
> with the thermally conductive pre-pregs, or any other similar material,
> I would appreciate your thoughts.
>
> thanks
>
> Ralph Vaughan
> Boeing-Atlanta
>
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