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July 1998

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TechNet <[log in to unmask]>
Subject:
Wire Bonding and Immersion White Tin
From:
Paul Wilson <[log in to unmask]>
Date:
Wed, 15 Jul 1998 07:14:49 -0400
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"TechNet E-Mail Forum." <[log in to unmask]>, Paul Wilson <[log in to unmask]>
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TN:

Has anyone heard of any developments in wire bondability with respect to immersion white tin?

Specifically, tinned leads were viewed early on as candidates for wire bonding, but not much has been seen since that comment in a 9/23/97 IPC Proceedings publication.

Paul Wilson
Plant Chemist

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