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July 1998

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"Meschter, Stephan J" <[log in to unmask]>
Date:
Wed, 1 Jul 1998 14:11:28 -0400
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Lenny Kurup <[log in to unmask]>
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From:
Lenny Kurup <[log in to unmask]>
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USE THE FORMER CLEANER, THE LATTER WILL PRODUCE A VERY ROUGH TOPOGRAPHY.

On Wed, 1 Jul 1998, Meschter, Stephan J wrote:

> Hi technetters,
> I have some 24K gold foil that is 16 mils thick that I would like to get
> very clean and polished for some soldering studies. I have two issues:
>
> (1) I have some Au foil pieces that were conventionally polished which have
> silicon carbide grit embedded in them that I would like to dissolve away.
>
> (2) These samples were also chemically polished with an etchant composed of
> 10% potassium cyanide (KCN) and 10% Ammonium persulfate in water.  I was
> wondering if this solution would leave any residues on the surface....Would
> a 50% hydrochloric acid, 50% Nitric Acid (aquaregia) etch be better?
>
> Thanks for any help....
> Steph
>
> *********************************************************
> Stephan Meschter               [log in to unmask]
> Lockheed Martin Control Systems  Phone  :(607)770-2332
> 600 Main Street, MD R52F         FAX    :(607)770-2056
> Johnson City, NY 13790-1888      MARCALL: 8 * 255-2332
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>
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