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Content-Type:	text/plain
Sender:	TechNet <[log in to unmask]>
Subject:	Re: IPC HOLE TO LEAD RATIOS
From:	"Hurst, Joe" <[log in to unmask]>
Date:	Wed, 1 Jul 1998 08:35:17 -0400
MIME-Version:	1.0
X-To:	"[log in to unmask]" <[log in to unmask]>
Reply-To:	"TechNet E-Mail Forum." <[log in to unmask]>, "Hurst, Joe" <[log in to unmask]>
Parts/Attachments:	text/plain (49 lines)

Rich:

                I don't know where it came from, but it works very well.

Joe Hurst

> -----Original Message-----
> From: [log in to unmask] [SMTP:[log in to unmask]]
> Sent: Tuesday, June 30, 1998 8:01 PM
> To:   [log in to unmask]
> Subject:      [TN] IPC HOLE TO LEAD RATIOS
>
>      Could someone enlighten me on how the hole to lead ratios for through
>      hole technology was derived in IPC-D-275?
>
>      Specifically, does it;
>         consider automated placement or manual insertion?
>         consider hand assembly, wave solder, reflow solder, or any?
>
>      Thank you very much, Rich.
>
>      [log in to unmask]  -  NEW ADDRESS!
>
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