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July 1998

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From:
"Meschter, Stephan J" <[log in to unmask]>
Date:
Wed, 1 Jul 1998 12:09:30 -0400
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"TechNet E-Mail Forum." <[log in to unmask]>, "Meschter, Stephan J" <[log in to unmask]>
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Hi technetters,
I have some 24K gold foil that is 16 mils thick that I would like to get
very clean and polished for some soldering studies. I have two issues:

(1) I have some Au foil pieces that were conventionally polished which have
silicon carbide grit embedded in them that I would like to dissolve away.

(2) These samples were also chemically polished with an etchant composed of
10% potassium cyanide (KCN) and 10% Ammonium persulfate in water.  I was
wondering if this solution would leave any residues on the surface....Would
a 50% hydrochloric acid, 50% Nitric Acid (aquaregia) etch be better?

Thanks for any help....
Steph

*********************************************************
Stephan Meschter               [log in to unmask]
Lockheed Martin Control Systems  Phone  :(607)770-2332
600 Main Street, MD R52F         FAX    :(607)770-2056
Johnson City, NY 13790-1888      MARCALL: 8 * 255-2332
*********************************************************

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