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June 1998

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Subject:
From:
"Chan, Marcelo" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 5 Jun 1998 09:38:02 -0400
Content-Type:
text/plain
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text/plain (26 lines)
Hi,

A common practice post assembly of portable electronics is to conduct a 3-feet
drop onto concrete.... I have a PCMCIA assembly onto which we are require to
perform that test.... and I have some questions related to that..... Since my
cards are only 24 mils thick or so and very light, I would like to know if the
way that the assembly hits the floor is an issue, i.e hits on one of the corners
vs. on its backside.... is there a widely accepted procedure that I could obtain
a copy that would clarify this issue....

Thanks,

Marcelo

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