In a message dated 06/04/98 15:53:56, you wrote:

>Is anybody out there utilizing BGAs or Micro BGAs for any SPACE
>applications, or know if they are being used?
>
>If so, what are the applicable specifications and standards (NHB 5300, IPC)?
>
>Does anyone have qualification or testing documentation of related
>reliability?

Get yourself a copy of IPC-D-279, Design Guidelines for Reliable Surface Mount
Technology Printed Board Assemblies, and/or ANSI/IPC J-STD-013, Implementation
of Ball Grid Array and Other High Density Technology.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]

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