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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 4 Jun 1998 23:17:38 EDT |
Content-Type: | text/plain |
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Hi Bruce,
While your problem may well be too much weak Au-Sn intermetallic compounds
(Your failure surfaces should than go through the solder), there is another
possibility. Your materials (brass, BeCu) may not be solderable, or your
soldering conditions (flux, heat) may not be adequate for these materials (
inthis case the failures should be right along the solder/lead interfaces
neatly separating the materials.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]
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