there are charts and recommendations for containing limits and remedies for
when something starts to get out of tolerance....but when you actually
exceed the limits, you must dump your pot and refill it with fresh solder.
I have a chart with these recommendations if you would like it.

Jason Smith
process materials engineer
Lexmark Electronics




Chris_Smith <[log in to unmask]>
06/01/98 08:46 AM


Please respond to "TechNet E-Mail Forum."
      <[log in to unmask]>; Please respond to
      Chris_Smith <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Jason Smith)
bcc:  Jason Smith
Subject:  [TN] Solder Sample Testing?




     Ladies & Gentlemen,
         I am currently working on a schedule for solder pot sampling. The
     pots will be tested every 30 days and two samples will be taken from
     each pot.  This way if one test happens to fail, we can send the other
     sample to verify the test.  The problem I have ran into is what to do
     if it fails.  In a recent customer audit I was asked what kind of
     containment would we have if the test failed?  Since we are using the
     ANSI/J-STD-001A there are clearly defined limits that must be met.  It
     is my understanding that when you test the solder you are testing for
     the last 30 days. The problem I have is this.  If I test the pot on
     1-1-98 and it passes I'm fine.  But when I test again on 2-1-98 and it
     fails I have a huge problem.  Since the last day I can prove the
     solder was within limits was Jan, 1 that makes everything suspect bad
     material to that date.  I can't write the procedure to recall
     everything for the last 30 days, I need a different solution.  If you
     have any information on how your company handles this please let me
     know.  Please keep in mind, that we must meet the ANSI-STD and any
     element out of range is considered a failure to our customer,
     regardless if the solder integrity is affected or not.

     Thanks
     Chris Smith
     Manufacturing Engineer

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