How about excluding oxygen and moisture?

 ----------
From:  Stefan Pollmeier[SMTP:[log in to unmask]]
Reply To:  TechNet E-Mail Forum.;Stefan Pollmeier
Sent:  Thursday, June 04, 1998 12:29 PM
To:  [log in to unmask]
Subject:  [TN] Reflow soldering: forced gas vs. infra-red

Dear TechNetters,

a contract manufacturer has problems in controlling the soldering
process after switching to forced gas (from infra-red).

One idea was letting us change land patterns ("my experience: oval works
better than rectangular"). Any experience reports, hints, literature
regarding land patterns _and_ soldering process would be welcome.

Any hints on process optimization we could forward to our contract
manufacturer are also welcome (is there a "top ten faults in forced gas
convection soldering"?).

Thank you very much in advance.

Best regards

Stefan Pollmeier

 --
Stefan Pollmeier                 [log in to unmask]

ESR Pollmeier GmbH               Tel. +49 6167 9306-0
Lindenstr. 20                    Fax  +49 6167 9306-77

D-64372 Ober-Ramstadt, Germany

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